Materials 
Insulator body material : PPS.  UL94V-O
Pin (outer sleeve) :Brass,CuZn38Pb2,machined QQ-B626D MIL-5-83505
Clip :Beryllium Copper,heat treated QQ-C533 MIL-5-83505
Plating pin :
Tin plated; min,2 um nickel+min 4um tin QQ-N-209 MIL-T-10727 Type
1 Gold plated : min,2 um nickel+0.25um full gold QQ-N-290 MIL-G-4520 4B
Clip : 6-finger
Gold plated :typical 2um
Nickel (min.13 um)+min 0.75 um full gold
 
Electrical
Maximum current :1A
Contact resistance per contact :<4m?
Insulation resistance :≧10000MΩ at 500VAC
Rated  voltage  :           100 VRMS /150VDC
Air and creepage distance : 0.6mm
Capacitance:                0.3pF max

Mechanical 
Average press fit of pin in insulator body : 58N
Average press fit of clip in pin : 65N
Average insertion force with steel pin Φ0.46mm :<80g
Average withdrawal force with steel pinΦ0.46mm :>15g
Min,insertion depth with positive contact :Min Φ0.41mm MaxΦ0.56mm
Mechanical life cycle.(No of insertion and withdrawal cycles with steel pin Φ0.46mm)
Operating temperature tange
Gold plated version : -55℃to+125℃continuous
Tin plated version :-40℃ to+105℃ continuous
Max.soldering temperature without damage :260℃,10 seconds
Solderabiliy :IEC 68-2-20 MIL-202 M208
Shock :Electrical discontinuities and Other damage noted after acceleration
of 10X200g :<50ns,IEC 68-2-27 MILSTD 202E no other damage
Vibration :Electrical discontinuities and damage noted after vibration with
10-2000Hz,20g Ih : <50ns,IEC 68-2-6 MIL-S-83505 no other damage
Humidity withstanding of contacts :Maximum increase of  contacts resistance
after 21 days,40℃,93%RH : <3mΩ     

Salt spray withstanding of contacts :Maximum   increase of contact resistance
after 48h,35℃,5% NaCI :<3m Ω IEC 68-2-11 MIL-7344-A01001.1
Thermal shock withstanding of contacts Maximum increase of contact resistance
after 4 cycles-10℃ to+85℃,Ih/cycle : <3m Ω IEC 68-2-14
Resistance against detergents :IEC 38-2-45
Polarization :A slight curve on the top left-hand corner of the socket body 
Application
Solderability (IEC 60068-2-20. Ta)  :235  C, 2s  
Resistance to soldering heat  (IEC 60068-2-20.  Tb) :
- Through hole mount components     :260  C,  10s